DocumentCode :
1513549
Title :
A Unified Method for Calculating Capacitive and Resistive Coupling Exploiting Geometry Constraints on Lightly and Heavily Doped CMOS Processes
Author :
Bontzios, Yiorgos I. ; Hatzopoulos, Alkis A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Aristotle Univ. of Thessaloniki, Thessaloniki, Greece
Volume :
57
Issue :
8
fYear :
2010
Firstpage :
1751
Lastpage :
1760
Abstract :
A method for calculating capacitive and resistive coupling is developed in this work, and its implementation in commonly encountered practical cases is presented. The method is based on the geometry of the coupling mechanism, and the derived model is therefore, in general, scalable and technology independent. The constraints of any related problem can easily be incorporated into this method, whereas pure 3-D effects, such as capacitive coupling, are fast and accurately computed. The proposed method is validated using measurements from a test chip in the UMC 0.18- μm CMOS lightly doped process, simulation data obtained by two commercial simulators, and theoretical results. The accuracy of the method is shown to be within 2%-10%.
Keywords :
CMOS integrated circuits; semiconductor doping; capacitive coupling; geometry constraints; heavily doped CMOS processes; lightly doped CMOS processes; resistive coupling; size 0.18 mum; CMOS process; CMOS technology; Circuit simulation; Computational modeling; Coupling circuits; Geometry; Integrated circuit modeling; Optical coupling; Semiconductor device modeling; Solid modeling; CMOS integrated circuits; geometric modeling; integrated circuit noise; substrate coupling;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2010.2050112
Filename :
5483118
Link To Document :
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