• DocumentCode
    151409
  • Title

    Modulation schemes for a 30 MVA IGCT converter using NPC H-bridges

  • Author

    Jie Shen ; Schroder, Stephan ; Bo Qu ; Yingqi Zhang ; Kunlun Chen ; Fan Zhang ; Zhang, Rongting

  • Author_Institution
    GE Global Res., Munich, Germany
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    5531
  • Lastpage
    5538
  • Abstract
    This paper demonstrates the impact of modulation schemes on the power capability of a high-power converter with low pulse ratios. This IGCT converter uses a five-level Neutral-Point-Clamped H-bridge topology. It is concluded that phase-shifted carrier modulators are not attractive for such converters at low pulse ratios due to the poor THD (Total Harmonic Distortion) performance and poor power capability. The THD performance is a key indicator for optimizing the performance of IGCT converters. Therefore, low-THD patterns like the level-shifted carrier and Optimized Pulse Patterns are proposed. It is explored that a smart and instantaneous pattern distribution is a key factor to ensure a robust modulator design. Compared to the standard interleaving concept, the proposed modulation schemes allow a power capability increase up to 40%. Meanwhile, the current THD is reduced from 11% to 4-7%. The concept is implemented and experimentally validated up to 30 MVA on an industrial IGCT converter.
  • Keywords
    harmonic distortion; phase shift keying; power convertors; IGCT converter; NPC H-bridges; THD; apparent power 30 MVA; five-level neutral-point-clamped H-bridge topology; high-power converter; instantaneous pattern distribution; level-shifted carrier; low pulse ratios; modulation schemes; optimized pulse patterns; phase-shifted carrier modulators; robust modulator; smart pattern distribution; total harmonic distortion; Amplitude modulation; Legged locomotion; Performance evaluation; Stress; Thermal stresses; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
  • Conference_Location
    Pittsburgh, PA
  • Type

    conf

  • DOI
    10.1109/ECCE.2014.6954159
  • Filename
    6954159