DocumentCode :
1515906
Title :
Foreword
Author :
Kaw, R. ; Prince, Jerry L.
Author_Institution :
Agilent Technologies, Inc.
Volume :
24
Issue :
3
fYear :
2001
Firstpage :
234
Lastpage :
235
Keywords :
Crosstalk; Educational institutions; Electronics packaging; Integrated circuit interconnections; Power distribution; Power system interconnection; Power system modeling; Radio frequency; Signal analysis; Signal design;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2001.938288
Filename :
938288
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1515906
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