DocumentCode
1515906
Title
Foreword
Author
Kaw, R. ; Prince, Jerry L.
Author_Institution
Agilent Technologies, Inc.
Volume
24
Issue
3
fYear
2001
Firstpage
234
Lastpage
235
Keywords
Crosstalk; Educational institutions; Electronics packaging; Integrated circuit interconnections; Power distribution; Power system interconnection; Power system modeling; Radio frequency; Signal analysis; Signal design;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2001.938288
Filename
938288
Link To Document