DocumentCode :
1515939
Title :
Power plane SPICE models and simulated performance for materials and geometries
Author :
Smith, Larry D. ; Anderson, Raymond ; Roy, Tanmoy
Author_Institution :
Sun Microsyst. Inc., Palo Alto, CA, USA
Volume :
24
Issue :
3
fYear :
2001
fDate :
8/1/2001 12:00:00 AM
Firstpage :
277
Lastpage :
287
Abstract :
A SPICE model for power plane simulation has been developed. It is based on the geometries and materials of the power planes and uses a unit cell composed of RLC elements, transmission line elements or the HSPICE W-element. Simulated resonances in the frequency domain and delays in the time domain are consistent with results calculated from physical dimensions. SPICE model simulations compare well with hardware measurements in both the frequency and time domains. The role of dielectric thickness, dielectric constant and parallel pairs of power planes is demonstrated through simulation. The spreading inductance of power planes is defined, discussed and measured. Power plane performance in terms of impedance, resonances, damping and spreading inductance is optimized by the use of a thin dielectric layer between conductive planes
Keywords :
SPICE; capacitance; inductance; permittivity; power electronics; printed circuit design; resonance; skin effect; HSPICE W-element; PCB power planes; RLC elements; conductive planes; damping; delays; dielectric constant; dielectric thickness; frequency domain; impedance; parallel pairs; power plane SPICE models; power plane geometries; power plane materials; power plane performance optimisation; power plane simulation; simulated resonances; spreading inductance; thin dielectric layer; time domain; transmission line elements; Delay effects; Dielectric constant; Dielectric measurements; Frequency domain analysis; Geometry; Hardware; Power transmission lines; Resonance; SPICE; Transmission line measurements;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/6040.938294
Filename :
938294
Link To Document :
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