Reaction analysis in stripline circuits

Author

Kabir, Sutirtha ; Dvorak, Steven L. ; Prince, John L.

Author_Institution

Motorola Inc., Tempe, AZ, USA

Volume

24

Issue

3

fYear

2001

fDate

8/1/2001 12:00:00 AM

Firstpage

347

Lastpage

356

Abstract

In this paper, a full-wave layered-interconnect simulator (UA-FWLIS), which is capable of simulating EM effects in packaging-interconnect problems, is introduced. Standard integral-equation-based method of moment (MoM) techniques are employed in UA-FWLIS. However, instead of using standard time-consuming numerical integration techniques, we have analytically evaluated the MoM reaction elements, thereby greatly improving the computational efficiency of the simulator. This paper illustrates the application of the simulator by employing it in the studies of coupling in a stripline structure and S-parameters for an interconnect

Keywords

S-parameters; circuit simulation; integral equations; integrated circuit interconnections; integrated circuit packaging; method of moments; microwave integrated circuits; strip line circuits; EM effects; S-parameters; UA-FWLIS; computational efficiency; full-wave layered-interconnect simulator; integral-equation-based method of moment techniques; packaging-interconnect problems; stripline circuits; stripline structure; Analytical models; Circuit analysis; Circuit simulation; Computational efficiency; Computational modeling; Integrated circuit interconnections; Moment methods; Packaging; Scattering parameters; Stripline;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.938302

Filename

938302