Title :
Modeling differential via holes
Author :
Laermans, Eric ; De Geest, Jan ; De Zutter, Daniël ; Olyslager, Frank ; Sercu, Stefaan ; Morlion, Danny
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Belgium
fDate :
8/1/2001 12:00:00 AM
Abstract :
In this paper, we present a method to characterize differential via holes in printed circuit boards in a both fast and accurate way. The via hole is modeled as a cascade of capacitances and inductances. We use FASTCAP to compute the values of the capacitances, and a closed form formula to obtain the inductance values. The numerical predictions are compared with experimental data
Keywords :
capacitance; circuit layout CAD; circuit simulation; inductance; printed circuit layout; FASTCAP; capacitances; closed form formula; differential via holes; inductances; numerical predictions; printed circuit boards; Capacitance; Connectors; Frequency; Inductance; Integrated circuit interconnections; Interference; Printed circuits; Reflection; Signal analysis; Signal design;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.938303
