DocumentCode
1515998
Title
Foreword
Author
Troster, G. ; Scheffler, Marc
Author_Institution
ETH Zurich
Volume
24
Issue
3
fYear
2001
Firstpage
364
Lastpage
365
Keywords
Application software; Electronics packaging; Energy consumption; Europe; Helium; Implants; Integrated circuit packaging; Optical interconnections; Performance loss; Pervasive computing;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2001.938304
Filename
938304
Link To Document