A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems

Author

Griese, Elmar

Author_Institution

Dept. of Opt. Interconnection Technol., Siemens SBS-C-LAB, Paderborn, Germany

Volume

24

Issue

3

fYear

2001

fDate

8/1/2001 12:00:00 AM

Firstpage

375

Lastpage

383

Abstract

A new and innovative interconnection technology applicable for printed circuit boards is presented. This technology is widely compatible with the existing design and manufacturing processes and technologies for conventional multilayer pc boards and it combines electrical and optical interconnects on pc board level. It provides the potential for on-board bandwidth of several Gb/s and closes the bottleneck caused by the limited performance of electrical interconnection technology. After giving an overview on the most important basic technologies and first available results and engineering samples, the focus of this paper is on the development of appropriate modeling methodologies and simulation algorithms necessary for designing and optimizing optical on-board interconnects within the conventional electrical pc board environment

Keywords

integrated circuit interconnections; optical interconnections; printed circuit layout; high-speed electronic systems; hybrid electrical-optical interconnection technology; modeling methodologies; multilayer pc boards; on-board bandwidth; optical on-board interconnects; printed circuit boards; simulation algorithms; Appropriate technology; Bandwidth; Design engineering; Integrated circuit interconnections; Manufacturing processes; Nonhomogeneous media; Optical design; Optical interconnections; Printed circuits; Process design;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.938306

Filename

938306