High performance modules of 2.5 Gbps modulator integrated DFB lasers using new RF impedance matching technique

Author

Lee, S.H. ; Ahn, J.H. ; Oh, Y.K. ; Ma, J.S. ; Choo, A.G. ; Kim, T.I. ; Yonggyoo Kim ; Jeong, Jichai

Author_Institution

Dept. of Radio Eng., Korea Univ., Seoul, South Korea

Volume

24

Issue

3

fYear

2001

fDate

8/1/2001 12:00:00 AM

Firstpage

407

Lastpage

410

Abstract

We report the improvement of frequency response characteristics of 2.5 Gbps modulator integrated distributed feedback (MI-DFB) laser modules using new impedance matching technique. Frequency responses for the fabricated module using the `+´ shaped microstrip line for impedance matching have been significantly improved such as the RF return loss of 11 dB and the 3 dB frequency bandwidth of 4.1 GHz, compared to 6 dB return loss and 1.5 GHz bandwidth for the conventional module. These results can also be predicted by the simulation of frequency responses for the modules, From the fabricated MI-DFB laser modules, good transmission performance has been obtained up to 640 km

Keywords

S-parameters; distributed feedback lasers; equivalent circuits; frequency response; impedance matching; optical modulation; optical transmitters; semiconductor device packaging; semiconductor lasers; 11 dB; 2.5 Gbit/s; 3 dB frequency bandwidth; 4.1 GHz; 640 km; MI-DFB laser modules; RF impedance matching technique; RF return loss; frequency response characteristics; modulator integrated distributed feedback laser modules; shaped microstrip line; transmission performance; Bandwidth; Chirp modulation; Circuit simulation; Distributed feedback devices; Frequency response; Impedance matching; Laser feedback; Microstrip; Radio frequency; Resistors;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.938310

Filename

938310