Title :
Dual-frequency and broad-band antennas with stacked quarter wavelength elements
Author :
Zaïd, Lakhdar ; Kossiavas, Georges ; Dauvignac, Jean-Yves ; Cazajous, Josiane ; Papiemik, A.
Author_Institution :
Lab. d´´Electron., Univ. de Nice-Sophia Antipolis, Valbonne, France
fDate :
4/1/1999 12:00:00 AM
Abstract :
Original lightweight, low-cost, and compact air-filled planar antennas with short-circuited elements, fed by a coaxial probe, for dual-frequency (S-antenna) and wide-band applications (E-antenna) are investigated. The two-band frequency antenna is formed of two stacked quarter-wavelength elements, short-circuited along diametrically opposed planes. This structure offers two modes with different radiation characteristics. The ratio between the two frequencies can be closely controlled within a range varying from 1.3-2. A bandwidth of 30% for a VSWR <2 is demonstrated using two stacked quarter-wavelength elements short-circuited along the same plane. Numerical simulation results are compared with experiments and a very good agreement is observed. Radiation patterns and input impedance of both structures are measured and the effects of various physical parameters are presented
Keywords :
UHF antennas; antenna feeds; antenna radiation patterns; electric impedance; microstrip antenna arrays; mobile antennas; multifrequency antennas; planar antenna arrays; E-antenna; S-antenna; UHF; VSWR; bandwidth; broad-band antennas; coaxial probe; compact air-filled planar antennas; dual-frequency antennas; experiments; frequencies ratio; input impedance; lightweight antennas; low-cost planar antennas; microstrip patch antennas; mobile communications; numerical simulation results; physical parameters; radiation characteristics; short-circuited elements; stacked quarter wavelength elements; two-band frequency antenna; Antenna radiation patterns; Bandwidth; Coaxial components; Current density; Frequency; Impedance; Microstrip antennas; Numerical simulation; Probes; Telecommunications;
Journal_Title :
Antennas and Propagation, IEEE Transactions on