• DocumentCode
    1517263
  • Title

    New microcharacters for wafer identification

  • Author

    Suzuki, Eiko ; Matsuda, Hajime ; Chiba, Teiichirou ; Mori, Akira

  • Author_Institution
    NEC Corp., Kanagawa, Japan
  • Volume
    14
  • Issue
    3
  • fYear
    2001
  • fDate
    8/1/2001 12:00:00 AM
  • Firstpage
    180
  • Lastpage
    186
  • Abstract
    Conventional identification (ID) systems use characters that are often illegible, with character recognition being difficult in as many as 20% of all processes. In contrast, new microcharacters in the V-shaped notch are clearly recognized throughout the process. The results can be explained by the following multiple effects. Marking location: These markings require only a small space. Hence, markings can even be in the beveled section of the V-shaped notch of a wafer. In the case of conventional ID systems, it is difficult to select an area that gives good readability during processes and wide enough for marking. Dot topography: A marking dot formed by conventional laser marking has a central depression due to the process of general heat distribution. In contrast, a marking dot formed by micro marking has a central peak protruding from the surface that is more easily distinguished than a dot that has a central depression. The contrast of the new dot is about two times greater than that of a conventional one. Contrast greatly influences readability
  • Keywords
    VLSI; character recognition; identification technology; integrated circuit manufacture; laser beam machining; surface topography; V-shaped notch; beveled section; central depression; character recognition; contrast; dot topography; heat distribution; identification systems; multiple effects; readability; wafer identification; Character recognition; History; Identity management systems; Manufacturing processes; Microscopy; National electric code; Production systems; Semiconductor materials; Surface topography; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.939809
  • Filename
    939809