DocumentCode :
1517919
Title :
Systematic Analysis Methodology for Mobile Phone's Electrostatic Discharge Soft Failures
Author :
Kim, Ki Hyuk ; Kim, Yongsup
Author_Institution :
Digital Media & Commun. R&D Center, Samsung Electron. Co., Ltd., Suwon, South Korea
Volume :
53
Issue :
3
fYear :
2011
Firstpage :
611
Lastpage :
618
Abstract :
A systematic analysis methodology for mobile phone´s electrostatic discharge (ESD) soft failures is proposed. The proposed analysis methodology consists of two parallel processes: one is the ESD simulation and the other is the ESD characterization of the mobile phone. The ESD simulation models that consist of the ESD generator, the ESD testing setup, and a mobile phone are also developed and their accuracy is experimentally verified. The proposed methodology is applied to design the countermeasures against the ESD soft failure of the slide-type mobile phones and the root causes of the ESD soft failures are analyzed. The RC low-pass filters are designed to improve the ESD immunity of the mobile phone and the ESD simulation results of the improved mobile phone show more than 82% voltage-level reductions of the signals, which cause the ESD soft failures. In order to verify that the reduced voltage levels, actually, solve the problem of ESD soft failures, the improved mobile phone´s ESD immunity is characterized again, and no ESD soft failure is detected.
Keywords :
electrostatic discharge; mobile handsets; radiofrequency interference; ESD characterization; ESD generator; ESD immunity; ESD simulation; ESD soft failure; ESD testing setup; RC low-pass filter; electromagnetic interference; electrostatic discharge soft failure; parallel process; slide-type mobile phone; systematic analysis methodology; voltage-level reduction; Batteries; Electrostatic discharge; Generators; Integrated circuit modeling; Mobile communication; Mobile handsets; Testing; Digital circuits; electromagnetic analysis; electromagnetic interference; electrostatic discharge (ESD);
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2011.2143719
Filename :
5768072
Link To Document :
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