Title :
A novel approach to 3-D modeling of packaged RF power transistors
Author :
Johansson, Ted ; Arnborg, Torkel
Author_Institution :
Ericsson Components AB, Kista, Sweden
fDate :
6/1/1999 12:00:00 AM
Abstract :
Packaged radio frequency (RF) power transistors with internal matching networks for use at 1.8-2 GHz in cellular base stations have been modeled using three-dimensional (3-D) electromagnetic-field simulators and SPICE. A method for extracting the actual internal 3-D geometries applying scanning electron microscope micrographs and software running in Java was developed. The results show good correlation between measured and simulated data in the 0.1-6 GHz interval studied. The importance of the mutual coupling and capacitance contributions from the package was demonstrated for different frequency domains. The described approach provides an interesting and promising method for modeling the interior parts of RF power transistors or other complex package structures, where geometry and coupling play a far greater role than for integrated-circuit packages
Keywords :
SPICE; UHF transistors; capacitance; electromagnetic coupling; electromagnetic field theory; electronic design automation; equivalent circuits; impedance matching; inductance; microwave power transistors; power transistors; semiconductor device models; semiconductor device packaging; 0.1 to 6 GHz; 1.8 to 2 GHz; 3D EM field simulators; 3D modeling; SPICE; capacitance; cellular base stations; electromagnetic-field simulators; internal 3D geometry extraction; internal matching networks; mutual coupling; packaged RF power transistors; radiofrequency power transistors; Base stations; Cellular networks; Data mining; Electromagnetic modeling; Geometry; Packaging; Power transistors; Radio frequency; SPICE; Three dimensional displays;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
