Accurate measurement of ground-ring inductance in ball grid array package

Author

Horng, Tzyy-Sheng ; Wu, Sung-Mao

Author_Institution

Inst. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

Volume

35

Issue

7

fYear

1999

fDate

4/1/1999 12:00:00 AM

Firstpage

520

Lastpage

521

Abstract

A new technique has been developed to measure the ground-ring inductance in a ball grid array (BGA) package. A simple parallel LC circuit is used to model the ground-ring parasitics at frequencies up to 1 GHz. After connecting an SMA connector to the ground ring of the BGA package, a network analyser can be used to measure the reflection coefficient (S₁₁) up to 1 GHz from which the ground-ring inductance can be extracted. It has been found that the ground-ring inductance depends very strongly on the phase of S₁₁. This leads to the advantage of excellent accuracy for the extracted quantities. The experimental ground-ring inductance data for a variety of BGA packages are verified by Ansoft simulation results

Keywords

ball grid arrays; electric connectors; inductance measurement; integrated circuit measurement; integrated circuit packaging; network analysers; 0 to 1 GHz; Ansoft simulation results; SMA connector; ball grid array package; ground-ring inductance; ground-ring parasitics; network analyser; parallel LC circuit; reflection coefficient;

fLanguage

English

Journal_Title

Electronics Letters

Publisher

iet

ISSN

0013-5194

Type

jour

DOI

10.1049/el:19990408

Filename

769455