Fibers in Printed Circuit Boards With Passively Aligned Coupling

Author

Schneider, Marc ; Kühner, Thomas ; Mohr, Jürgen ; Maas, Dieter

Author_Institution

Karlsruhe Inst. of Technol., Karlsruhe, Germany

Volume

28

Issue

15

fYear

2010

Firstpage

2121

Lastpage

2128

Abstract

Several types of printed circuit boards with embedded optical glass fibers for board level optical interconnects are presented. Transmitter and receiver coupling elements were developed which are solder temperature resistant and align passively on the fiber ends of the embedded glass fibers. Further a cost-effective demonstrator system using FPGA, serializer/deserializer, VCSEL driver, and photodiode amplifiers to test the optical interconnect was set up and is described.

Keywords

optical fibres; optical interconnections; printed circuits; FPGA; VCSEL driver; board level optical interconnects; cost-effective demonstrator system; deserializer; embedded optical glass fibers; passively aligned coupling; photodiode amplifiers; printed circuit boards; receiver coupling elements; solder temperature resistant; transmitter coupling elements; Coupling circuits; Field programmable gate arrays; Glass; Optical fiber testing; Optical interconnections; Optical receivers; Optical transmitters; Printed circuits; Stimulated emission; Temperature; Coupling element; VCSEL; electro-optical PCB; lamination; optical fiber devices; optical interconnections; optical printed circuit board; passive alignment; photodiodes;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/JLT.2010.2053019

Filename

5487379