Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling

Author

Coskun, Ayse K. ; Atienza, David ; Sabry, Mohamed M. ; Meng, Jie

Volume

31

Issue

4

fYear

2011

Firstpage

63

Lastpage

75

Abstract

This article explores the benefits and the challenges of 3D design and discusses novel techniques to integrate predictive cooling control with chip-level thermal-management methods such as job scheduling and voltage frequency scaling. Using 3D liquid-cooled systems with intelligent runtime management provides an energy-efficient solution for designing single-chip many-core architectures.

Keywords

computer architecture; cooling; logic design; low-power electronics; multiprocessing systems; power aware computing; 3D Systems; 3D liquid-cooled systems; active cooling; chip-level thermal-management methods; energy-efficient solution; high-performance computing; integrate predictive cooling control; intelligent runtime management; job scheduling; single-chip computing; single-chip many-core architecture design; voltage frequency scaling; Heat sinks; Manufacturing; Microchannel; Stacking; Thermal management; Three dimensional displays; 3D liquid-cooled systems; active cooling; emerging technologies; energy-aware systems; multiprocessor systems; temperature-aware design;

fLanguage

English

Journal_Title

Micro, IEEE

Publisher

ieee

ISSN

0272-1732

Type

jour

DOI

10.1109/MM.2011.39

Filename

5770260