• DocumentCode
    1520315
  • Title

    The Thickness Difference Method for Measuring the Thermal Conductivity of Thick Films

  • Author

    Huang, Mei-Jiau ; Chang, Tien-Yao ; Chien, Heng-Chieh ; Sun, Wei-Che ; Yao, Da-Jeng

  • Author_Institution
    Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    19
  • Issue
    4
  • fYear
    2010
  • Firstpage
    895
  • Lastpage
    902
  • Abstract
    A new experimental method, named the thickness difference method, is proposed for measuring the thermal conductivity of thick films. This method is developed based on a logarithmic relation regarding the difference of the total thermal resistances and the ratio of the film thicknesses between two similar systems. Such a logarithmic relation is supported by theoretical analysis and is analogous to that appearing in the steady heat diffusion problem between two concentric cylinders. Its accuracy is confirmed to be acceptable when the film thickness is large enough compared to the heating-wire width and small enough compared to the substrate width. The error analysis shows that the relative errors are under 1% for all film Biot numbers greater than 60. Finally, an associated experiment is also set up, and the measurement results confirm the accuracy of the proposed thickness difference method.
  • Keywords
    thermal conductivity measurement; thermal diffusion; thermal resistance; thick films; concentric cylinders; film Biot numbers; heat diffusion problem; heating-wire width; logarithmic relation; thermal conductivity measurement; thermal resistances; thick films; thickness difference method; Film; steady heat diffusion; thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2010.2051534
  • Filename
    5491027