DocumentCode
1521793
Title
Reactive ion etching of gallium nitride by methylchloride/hydrogen
Author
Dineen, M. ; Thomas, H. ; Humphreys, B. ; McMeekin, S.G.
Author_Institution
Sch. of Eng., Wales Univ., Cardiff, UK
Volume
35
Issue
8
fYear
1999
fDate
4/15/1999 12:00:00 AM
Firstpage
673
Lastpage
675
Abstract
The authors report on the reactive ion etching (RIE) of gallium nitride (GaN) using methylchloride/hydrogen, (CH3Cl/H2 ). The effect of RF power, total gas flow, pressure and gas ratio chemistry on etch rate were investigated and the optimum process identified. Etch rates of 100 nm/min were obtained using the optimised process conditions
Keywords
III-V semiconductors; gallium compounds; sputter etching; GaN; gallium nitride; methylchloride/hydrogen gas mixture; reactive ion etching;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19990451
Filename
771027
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