• DocumentCode
    1522658
  • Title

    Study on a C-class solvent-free silicone impregnating varnish

  • Author

    Li, Qiangjun ; Zhong, Jinghe ; Li, Yong ; Wang, Kai ; Jiang, Qibin ; Chen, Hongsheng

  • Author_Institution
    Zhuzhou Times New Mater. Technol. Co., Ltd., Zhuzhou, China
  • Volume
    17
  • Issue
    3
  • fYear
    2010
  • fDate
    6/1/2010 12:00:00 AM
  • Firstpage
    785
  • Lastpage
    790
  • Abstract
    In this paper, a new class of C-grade solvent-free silicone impregnating varnish was prepared by synthesizing polysilicone oligomers bearing methyl and phenyl groups. These oligomers also contained vinyl and hydrogen siloxane components which, under the influence of heat and platinum catalysis, induced crosslinking of the impregnating varnish. The varnish without any solvents kept liquid and flowed easily at room temperature (RT) and was heated to cure to a rigid membrane at high temperature up to 473 K. The properties of the varnish before and after curing were depicted in details, and the mechanism for synthesis of the solvent-free silicone impregnating varnish was introduced. The solvent-free silicone impregnating varnish was used on the winding as dielectric shield for a motor or electric device by vacuum pressure impregnation (VPI) which is the most conventional method for impregnation of the winding for a motor. The silicone varnish, which contained no decomposable and physiologically problematic components, was of very low volatility suitable for VPI. The application technology and processing conditions of the silicone impregnating varnish were discussed in details and a simulant procedure and a practical sketch about the four steps involved in the VPI process employing the silicone impregnating varnish were illustrated.
  • Keywords
    Cable insulation; Curing; Dielectrics and electrical insulation; Hydrogen; Platinum; Pulse width modulation; Resins; Silicon on insulator technology; Temperature; Traction motors; Silicone resin, solvent-free impregnating varnish, application technology, VPI;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2010.5492251
  • Filename
    5492251