• DocumentCode
    1522890
  • Title

    Application of Wide-Band Material Characterization Methods to Printable Electronics

  • Author

    Pynttäri, Vesa J. ; Mäkinen, Riku M. ; Palukuru, Vamsi Krishna ; Östman, Kauko ; Sillanpää, Hannu P. ; Kanerva, Tomi ; Lepistö, Toivo ; Hagberg, Juha ; Jantunen, Heli

  • Author_Institution
    Dept. of Electron., Tampere Univ. of Technol., Tampere, Finland
  • Volume
    33
  • Issue
    3
  • fYear
    2010
  • fDate
    7/1/2010 12:00:00 AM
  • Firstpage
    221
  • Lastpage
    227
  • Abstract
    In this paper, characterization methods are presented with results from test structures printed with varying printing parameters and materials. It is shown that different process parameters affect both physical and electrical material properties and hence high-frequency material characterization is a vital part of the process providing important information for design purposes. The conductivities and loss information of nanoparticle inks and properties of dielectric material are achieved in addition to structural properties. In particular, dc measurement results from 1.1e7 S/m to 3.7e7 S/m and high-frequency attenuation values from 0.5 dB/cm to 2.8 dB/cm (at 10 GHz) are achieved for printed conductors.
  • Keywords
    conductors (electric); dielectric materials; ink jet printing; DC measurement; dielectric material; electrical material properties; high-frequency attenuation; high-frequency material characterization; ink jet printing; nanoparticle inks; physical material properties; printable electronics; printed conductors; test structures; wideband material characterization methods; Attenuation measurement; Conducting materials; Conductivity; Dielectric losses; Dielectric materials; Ink; Material properties; Materials testing; Printing; Wideband; Ink jet printing; material characterization;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2010.2051809
  • Filename
    5492288