DocumentCode :
1522978
Title :
Design and Characterization of a Multilevel DRAM
Author :
Koob, John C. ; Ung, Sue Ann ; Cockburn, Bruce F. ; Elliott, Duncan G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Alberta in Edmonton, Edmonton, AB, Canada
Volume :
19
Issue :
9
fYear :
2011
Firstpage :
1583
Lastpage :
1596
Abstract :
Multilevel DRAM (MLDRAM) increases the storage density of DRAMs by using more than two signal levels in the data storage cells. Our MLDRAM uses reference and data cell signals that are generated in the cell array using charge sharing. The single-step sensing method uses multiple reference signals in parallel. We describe an operational 19200-cell MLDRAM test chip in 1.8-V, 180-nm mixed-signal CMOS that allows 1, 1.5, 2, 2.25, and 2.5 bits-per-cell operation using 2, 3, 4, 5, and 6 data signal levels, respectively. Characterization features include a partitioned memory array with four different data cell sizes, two sense amplifier sizes, and selective bitline shielding. New tests were developed using an MLDRAM fault model covering basic functionality, retention time, multilevel march, inter-bitline coupling and cell plate voltage bump tests. We show that, with short bitlines, MLDRAM´s noise margins can be similar to DRAM´s to more reliably store two bits in a 1T1C cell.
Keywords :
CMOS memory circuits; DRAM chips; integrated circuit design; integrated circuit testing; 1T1C cell; bitline shielding; cell array; cell plate voltage bump tests; charge sharing; data cell signals; data storage cells; dynamic random-access memory; inter-bitline coupling; mixed-signal CMOS; multilevel DRAM; multilevel march; multiple reference signals; partitioned memory array; retention time; sense amplifier sizes; single-step sensing method; size 180 nm; storage density; voltage 1.8 V; Circuit faults; Delay; Logic; Noise reduction; Packaging; Random access memory; Research and development; Signal generators; Testing; Voltage; Dynamic random-access memory (DRAM); multilevel cell; multiple-valued logic;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2010.2051569
Filename :
5492301
Link To Document :
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