Highly reliable plastic packaging for laser diode and photodiode modules used for access network

Author

Fukuda, Motohisa ; Ichikawa, Fusao ; Yamada, Y. ; Inoue, Yasuyuki ; Kato, Kazuhiko ; Sato, Hikaru ; Sugie, Toshiharu ; Toba, H. ; Yoshida, J.

Author_Institution

NTT Opto-Electron. Labs., Kanagawa

Volume

33

Issue

25

fYear

1997

fDate

12/4/1997 12:00:00 AM

Firstpage

2158

Lastpage

2159

Abstract

The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85% RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters

Keywords

ageing; environmental testing; integrated optoelectronics; modules; optical fibre networks; optical receivers; optical transmitters; photodiodes; plastic packaging; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; stability; -40 to 85 C; LD modules; high humidity-high temperature tests; high reliability; laser diode modules; long term aging tests; low cost optical transmitters; photodiode modules; plastic packaging; stable operation; temperature cycling tests;

fLanguage

English

Journal_Title

Electronics Letters

Publisher

iet

ISSN

0013-5194

Type

jour

DOI

10.1049/el:19971365

Filename

645763