Title :
Miniature hybrid microwave ICs using a novel thin-film technology
Author :
Eda, Kazuo ; Miwa, Tetsuji ; Taguchi, Yutaka ; Uwano, Tiomoki
Author_Institution :
Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
fDate :
12/1/1990 12:00:00 AM
Abstract :
A novel thin-film technology for miniature hybrid microwave ICs is presented. All passive components, such as resistors and capacitors, are fully integrated on ordinary alumina ceramic substrates using the thin-film technology with very high yield. The numbers of parts and wiring processes were significantly reduced. This technology was applied to the fabrication of Ku-band solid-state power amplifiers. This thin-film technology offers the following advantages: (1) a very high yield fabrication process for thin-film capacitors having excellent electrical characteristics in the gigahertz range (ε=3.6, Q=230 at 12 GHz) and reliability; (2) two kinds of thin-film resistors having different temperature coefficients of resistivity (TCRs) and a lift-off process to integrate them with thin-film capacitors; and (3) a matching method using the thin-film capacitor
Keywords :
hybrid integrated circuits; integrated circuit technology; microwave amplifiers; microwave integrated circuits; power amplifiers; thin film circuits; 12 GHz; Al2O2; Ku-band; MIC; SHF; alumina ceramic substrates; gigahertz range; high yield fabrication process; lift-off process; matching method; miniature hybrid microwave ICs; reliability; solid-state power amplifiers; thin-film resistors; thin-film technology; Capacitors; Ceramics; Fabrication; Microwave technology; Power amplifiers; Resistors; Solid state circuits; Substrates; Transistors; Wiring;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
