Title :
Anisotropy in three-phase transformer circuit model
Author :
Elleuch, Mohammed ; Poloujadoff, Michel
Author_Institution :
Lab. de Syst Electrique, Ecole Nat. dIngenieurs, Tunis, Tunisia
fDate :
9/1/1997 12:00:00 AM
Abstract :
In this paper, an important discussion of transformer design and modeling is given. Anisotropy effects of the transformer laminations have been stressed in the light of the investigation of a three-phase three-limb transformer T-joint. Three simple T-joint modeling schemes accounting for the lamination anisotropy are proposed. The fundamental result is that the flux lines remain almost parallel to the rolling direction (RD), except in a small area around the T-joint. Therefore, transformer yokes and limbs have been divided into longitudinal elements according to the RD. Reluctances related to these elements are connected according to the magnetic circuit coupling and yield a new transformer circuit model. A good agreement is obtained between computed and measured transient currents. Furthermore, the new transformer model enables some localized analysis. The computed localized fluxes and loci of flux density vectors near to the T-joint exhibit a satisfactory agreement with many results based on FEM or experimental investigations
Keywords :
equivalent circuits; laminations; magnetic anisotropy; magnetic flux; power transformers; transformer cores; transformer magnetic circuits; transient analysis; T-joint modeling schemes; equivalent electrical circuit; flux density vectors; flux lines; grain-oriented steels; lamination anisotropy; localized analysis; longitudinal elements; magnetic circuit coupling; reluctances; rolling direction; three-phase three-limb transformer T-joint; three-phase transformer circuit model; transformer design; transformer laminations; transformer yokes; transient currents; Anisotropic magnetoresistance; Assembly; Lamination; Magnetic analysis; Magnetic circuits; Magnetic cores; Numerical analysis; Phase transformers; Steel; Transformer cores;
Journal_Title :
Magnetics, IEEE Transactions on