Ag Nanoparticle Paste Synthesis for Room Temperature Bonding

Time-dependent sintering properties of an Ag nanoparticle paste for room temperature bonding were investigated. Ag nanoparticle paste with a small amount of dodecylamine dispersant can sinter at room temperature by the evaporation of toluene solvent. When the solvent evaporates, sintering with neck growth and the coalescence of particles is initiated within half an hour and the Ag grain continues to grow gradually for hours. Furthermore, a time-dependent change in the shear strength is demonstrated using a bonding test with Cu plates at room temperature. Bonding between the Ag paste and a Cu plate is favorable and fracturing occurs within the sintered Ag body. The strength of sintered Ag increases with sintering time due to neck growth and the coalescence of particles. The shear strength is more than 8 MPa after 6 h and 12 h of drying.