Title :
Crossing the planes at high speed. Signal integrity issues at split ground and power planes
Author :
Liaw, Haw-Jyh ; Merkelo, Henri
Author_Institution :
Rambus Inc., Mountain View, CA, USA
fDate :
11/1/1997 12:00:00 AM
Abstract :
This article discusses a specific design situation that represents quite a broad class of problems in the study of signal integrity. The article focuses on the effects on high-speed signals that need to cross split ground planes and split power planes that act as signal references or partial references. Such configurations are frequently needed in the layout of printed circuit boards (PCBs), multichip modules (MCMs), and even single-chip modules. Examples of split ground and power planes are discussed first. The conventional effective inductance model is described briefly, and an accurate and efficient transmission line model is then discussed in detail. Examples of modeling and design trade-offs are also presented
Keywords :
digital signals; inductance; integrated circuit design; multichip modules; printed circuit design; transmission line theory; design layout; effective inductance model; high-speed signal; multichip module; partial reference; printed circuit board; signal integrity; signal reference; single-chip module; split ground plane; split power plane; transmission line model; Circuits; Energy management; Packaging; Power generation; Power supplies; Power system management; Routing; Signal design; Signal generators; Voltage;
Journal_Title :
Circuits and Devices Magazine, IEEE