• DocumentCode
    1524912
  • Title

    An Al/sub 0.3/Ga/sub 0.7/N/GaN undoped channel heterostructure field effect transistor with Fmax of 107 GHz

  • Author

    Li, R. ; Cai, S.J. ; Wong, L. ; Chen, Yuanfeng ; Wang, K.L. ; Smith, R.P. ; Martin, S.C. ; Boutros, K.S. ; Redwing, J.M.

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
  • Volume
    20
  • Issue
    7
  • fYear
    1999
  • fDate
    7/1/1999 12:00:00 AM
  • Firstpage
    323
  • Lastpage
    325
  • Abstract
    An Al/sub 0.3/Ga/sub 0.7/N/GaN heterostructure field effect transistor (HFET) grown on semi-insulating SiC with an 0.2-μm gate length is reported. A source-drain ohmic contact resistance of 0.15-/spl Omega/-mm was achieved through the use of high Al content and high n-type doping (1E19 cm/sup -3/) in the AlGaN donor layer and optimized metallization procedures. We obtained a maximum transconductance of 260 mS/mm, a saturated current density of 1.2 A/mm, and a maximum oscillation frequency in excess of 107 GHz in the devices. The results are one of the best achieved up to now, and they will open up the potential for the applications of AlGaN/GaN HFET´s in high-power microwave radar, remote sensing, and communications.
  • Keywords
    III-V semiconductors; aluminium compounds; contact resistance; current density; gallium compounds; microwave field effect transistors; microwave power transistors; ohmic contacts; power field effect transistors; semiconductor device metallisation; semiconductor doping; wide band gap semiconductors; 0.2 micron; 107 GHz; 260 mS/mm; Al/sub 0.3/Ga/sub 0.7/N-GaN; III-V semiconductors; high-power microwave applications; maximum oscillation frequency; maximum transconductance; n-type doping; optimized metallization procedures; saturated current density; source-drain ohmic contact resistance; undoped channel heterostructure field effect transistor; Aluminum gallium nitride; Contact resistance; Doping; Gallium nitride; HEMTs; MODFETs; Metallization; Ohmic contacts; Silicon carbide; Transconductance;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.772364
  • Filename
    772364