• DocumentCode
    1525036
  • Title

    On PD mechanisms at high temperature in voids included in an epoxy resin

  • Author

    Schifani, R. ; Candela, R. ; Romano, Pietro

  • Author_Institution
    Dept. of Electr. Eng., Palermo Univ., Italy
  • Volume
    8
  • Issue
    4
  • fYear
    2001
  • fDate
    8/1/2001 12:00:00 AM
  • Firstpage
    589
  • Lastpage
    597
  • Abstract
    In this paper the effects of temperature on partial discharge (PD) activity taking place inside a spherical void in epoxy resin system are studied. Indeed, some experimental tests previously performed on specimens, having different void shapes, under multi-stress condition of temperature and voltage, have shown very different PD amplitude distributions at temperatures higher than ambient. However, this phenomenon cannot be explained only by taking into account the different thermobaric conditions of the enclosed gas. In consequence of the general physical inaccessibility of such voids, a study is here performed using a numerical model based on an evolutionary optimization algorithm. This is used to evaluate the range values for the physical parameters of the insulating system influencing the observed changes in PD activity. Finally, comments are presented about the adopted criteria by which the comparison between the experimental data and the simulated ones is performed, and about the interpretation of the dependence on temperature of the experimental PD
  • Keywords
    epoxy insulation; evolutionary computation; partial discharges; PD mechanisms; amplitude distributions; epoxy resin; evolutionary optimization algorithm; insulating system; multi-stress condition; numerical model; spherical void; Epoxy resins; Insulation; Numerical models; Partial discharges; Performance evaluation; Shape; Temperature dependence; Temperature distribution; Testing; Voltage;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/94.946711
  • Filename
    946711