A high fill-factor infrared bolometer using micromachined multilevel electrothermal structures

Author

Lee, Hyung-Kew ; Yoon, Jun-Bo ; Yoon, Euisik ; Ju, Sang-Baek ; Yong, Yoon-Joong ; Lee, Wook ; Kim, Sang-Gook

Author_Institution

Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea

Volume

46

Issue

7

fYear

1999

fDate

7/1/1999 12:00:00 AM

Firstpage

1489

Lastpage

1491

Abstract

A high fill-factor uncooled infrared (IR) bolometer has been fabricated by using thin-film titanium resistors sandwiched in a surface-micromachined silicon oxinitride membrane (50 μm×50 μm). This bolometer is realized in multilevel electrothermal structures with a fill-factor over 92%. From the multilevel structure, thermal isolation can be independently optimized without sacrificing IR absorbing area. Initial measurements show a thermal time constant of 12 ms, a responsivity of 1600 V/W, and a detectivity (D*) of 5×10⁸ cm√Hz/W

Keywords

bolometers; infrared detectors; membranes; micromachining; microsensors; thin film resistors; SiON; Ti; fill factor; infrared bolometer; multilevel electrothermal structure; silicon oxynitride membrane; surface micromachining; thermal isolation; titanium thin film resistor; Arm; Biomembranes; Bolometers; Costs; Electrothermal effects; Infrared detectors; Micromachining; Optical imaging; Pyroelectricity; Thermal resistance;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/16.772496

Filename

772496