DocumentCode
1526547
Title
Flux pinning scaling behaviors of ultrafine multifilamentary NbTi superconducting wires with Nb island-type artificial pins
Author
Miura, O. ; Tei, C. ; Ito, D. ; Endo, S.
Author_Institution
Dept. of Electr. Eng., Tokyo Metropolitan Univ., Japan
Volume
7
Issue
2
fYear
1997
fDate
6/1/1997 12:00:00 AM
Firstpage
1146
Lastpage
1149
Abstract
In order to engineer composites for high critical current densities Jc, the establishment of an artificial pinning center (APC) composite technique based on the flux pinning mechanism is desired. For that purpose, we investigated temperature and magnetic field scaling behaviors on the flux pinning properties of several kinds of Nb island-type artificial pin wires. The temperature and magnetic field dependence of bulk pinning force densities Fp was evaluated from magnetization curves at 25-7.5K to exclude influences due to external effects such as filament sausaging. As a result it was found that the scaling law holds true in a wide range of temperatures and magnetic fields for all of the APC specimens, which is in contrast to /spl alpha/-Ti specimens. This result suggests that Nb island-type pinning is much stronger than ribbon-like /spl alpha/-Ti pinning.
Keywords
critical current density (superconductivity); flux pinning; magnetisation; multifilamentary superconductors; niobium; niobium alloys; titanium alloys; 2.5 to 7.5 K; Nb; Nb island-type artificial pins; NbTi; artificial pinning center; bulk pinning force densities; composites; external effects; filament sausaging; flux pinning mechanism; flux pinning scaling behaviors; high critical current densities; magnetic field scaling; magnetization; ribbon-like /spl alpha/-Ti pinning; scaling law; temperature dependence; ultrafine multifilamentary NbTi superconducting wires; Critical current density; Flux pinning; Magnetic fields; Magnetic properties; Magnetization; Niobium compounds; Temperature dependence; Temperature distribution; Titanium compounds; Wires;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/77.620694
Filename
620694
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