Editorial- three-dimensional integrated circuits design

3D Integration emerges as an attractive option to sustain Moore´s law as well as to enable More-than-Moore. Design and test techniques and methodologies for 3D designs are imperative to realise 3D integration; novel architectures and design space exploration at the architectural level are also essential to leverage 3D integration technologies for performance gain. This special issue of IET Computers & Digital Techniques covers various perspectives of designing future 3D ICs. A call for papers for this special issue was announced in May 2009. All submissions went through the regular review process of JETC. After review and appropriate revisions, seven papers on diverse topics related to 3D integration were accepted for this special issue.