• DocumentCode
    1527409
  • Title

    Spectral Models for the Estimation of Delay and Crosstalk in High-Speed Interconnects

  • Author

    Antonini, Giulio

  • Author_Institution
    Dept. of Electr. Eng., Univ. degli Studi dell´´Aquila, L´´Aquila, Italy
  • Volume
    52
  • Issue
    3
  • fYear
    2010
  • Firstpage
    728
  • Lastpage
    736
  • Abstract
    In this paper, a closed-form rational model is presented for the computation of the finite ramp response of multiconductor transmission lines, which allows the numerical estimation of delay and crosstalk of coupled dispersive and lossy interconnects. The proposed method is based on the closed-form dyadic Green´s function of the 1-D wave-propagation problem and allows to incorporate inductive as well as dispersive effects in a straightforward way. The proposed solution is obtained by combining the state-space models of the interconnect and terminations with no restriction as to the number of poles and nature of interconnect or terminations. The methodology is tested by comparison of the results with those obtained by using the Spice solver, the standard transmission-line theory and the inverse Fourier transform as well as lumped network models.
  • Keywords
    Green´s function methods; delay estimation; multiconductor transmission lines; spectral analysis; state-space methods; transient analysis; wave propagation; 1D wave-propagation problem; Spice solver; closed-form dyadic Green´s function; closed-form rational model; coupled dispersive interconnects; crosstalk; delay numerical estimation; dispersive effects; finite ramp response; high-speed interconnects; inductive effect; inverse Fourier transform; lossy interconnects; lumped network models; multiconductor transmission lines; spectral models; state-space models; transient analysis; transmission-line theory; Couplings; Crosstalk; Delay estimation; Dispersion; Fourier transforms; Green´s function methods; Multiconductor transmission lines; Propagation losses; Testing; Transmission lines; Crosstalk; delay; high-speed interconnects; transient analysis;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2010.2052363
  • Filename
    5498991