DocumentCode :
1527409
Title :
Spectral Models for the Estimation of Delay and Crosstalk in High-Speed Interconnects
Author :
Antonini, Giulio
Author_Institution :
Dept. of Electr. Eng., Univ. degli Studi dell´´Aquila, L´´Aquila, Italy
Volume :
52
Issue :
3
fYear :
2010
Firstpage :
728
Lastpage :
736
Abstract :
In this paper, a closed-form rational model is presented for the computation of the finite ramp response of multiconductor transmission lines, which allows the numerical estimation of delay and crosstalk of coupled dispersive and lossy interconnects. The proposed method is based on the closed-form dyadic Green´s function of the 1-D wave-propagation problem and allows to incorporate inductive as well as dispersive effects in a straightforward way. The proposed solution is obtained by combining the state-space models of the interconnect and terminations with no restriction as to the number of poles and nature of interconnect or terminations. The methodology is tested by comparison of the results with those obtained by using the Spice solver, the standard transmission-line theory and the inverse Fourier transform as well as lumped network models.
Keywords :
Green´s function methods; delay estimation; multiconductor transmission lines; spectral analysis; state-space methods; transient analysis; wave propagation; 1D wave-propagation problem; Spice solver; closed-form dyadic Green´s function; closed-form rational model; coupled dispersive interconnects; crosstalk; delay numerical estimation; dispersive effects; finite ramp response; high-speed interconnects; inductive effect; inverse Fourier transform; lossy interconnects; lumped network models; multiconductor transmission lines; spectral models; state-space models; transient analysis; transmission-line theory; Couplings; Crosstalk; Delay estimation; Dispersion; Fourier transforms; Green´s function methods; Multiconductor transmission lines; Propagation losses; Testing; Transmission lines; Crosstalk; delay; high-speed interconnects; transient analysis;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2010.2052363
Filename :
5498991
Link To Document :
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