Underfill of flip chip on laminates: simulation and validation

Author

Nguyen, L. ; Quentin, C. ; Fine, P. ; Cobb, B. ; Bayyuk, S. ; Yang, H. ; Bidstrup-Allen, S.A.

Author_Institution

Nat. Semicond. Corp., Santa Clara, CA, USA

Volume

22

Issue

2

fYear

1999

fDate

6/1/1999 12:00:00 AM

Firstpage

168

Lastpage

176

Abstract

The flow characteristics of a number of underfills were evaluated with quartz dies of different patterns and pitches bonded on different substrate surfaces. Perimeter, mixed array, and full array patterns were tested. Observations on the flow front uniformity, streaking, voiding, and filler segregation were collected, The information was compared with the results predicted by a new simulation code, plastic integrated circuit encapsulation-computer aided design (PLICE-CAD) under DARPA-funded development. The two-phase model of the combined resin and air takes into account geometrical factors such as bumps and die edges, together with boundary conditions in order to track accurately the propagation of the flow fronts, The two-phase flow field is based on the volume-of-fluid (VOF) methodology embedded in a general-purpose three-dimensional (3-D) flow solver

Keywords

circuit CAD; circuit simulation; digital simulation; encapsulation; flip-chip devices; laminates; 3D flow solver; DARPA-funded development; PLICE-CAD; boundary conditions; bumps; die edges; filler segregation; flip chip; flow characteristics; flow front uniformity; full array patterns; geometrical factors; laminates; mixed array patterns; perimeter patterns; plastic integrated circuit encapsulation-computer aided design; simulation code; streaking; two-phase model; underfills; voiding; volume-of-fluid methodology; Bonding; Boundary conditions; Circuit testing; Flip chip; Integrated circuit modeling; Laminates; Plastics; Predictive models; Resins; Solid modeling;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.774725

Filename

774725