DocumentCode
1527951
Title
Parametric dependence of fatigue of electronic adhesives
Author
Gladkov, Alex ; Bar-Cohen, Avram
Author_Institution
Minnesota Univ., Minneapolis, MN, USA
Volume
22
Issue
2
fYear
1999
fDate
6/1/1999 12:00:00 AM
Firstpage
200
Lastpage
208
Abstract
Adhesives used in electronic applications are subject to high cyclic shear stresses resulting from differential thermal expansion of the bonded materials. In this study, an attempt has been made to experimentally determine the dependence of the fatigue life of two packaging epoxy adhesives on: temperature, peak cycling stress as a fraction of adhesion strength, and cyclic frequency. Both epoxies were used to bond surfaces of aluminum and silicon. Tensile lap-shear specimens were used
Keywords
adhesives; fatigue; packaging; reliability; thermal expansion; adhesion strength; cyclic shear stresses; differential thermal expansion; electronic adhesives; epoxy adhesives; fatigue life; packaging; peak cycling stress; tensile lap-shear specimens; Adhesives; Aluminum; Bonding; Electronic packaging thermal management; Fatigue; Frequency; Temperature dependence; Tensile stress; Thermal expansion; Thermal stresses;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.774732
Filename
774732
Link To Document