Title :
Chemical kinetic model of interfacial degradation of adhesive joints
Author :
Lam, David C C ; Yang, Fan ; Tong, Pin
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Techno.l, Hong Kong
fDate :
6/1/1999 12:00:00 AM
Abstract :
Mechanical properties of adhesive joints are degraded in the presence of water. The progressive decrease in strength has been attributed to propagation of interfacial crack. Water diffusion and stress distribution within the adhesive joint as a function of time has been modeled using finite elements in this study. The stress history at the interface displayed spatially invariant characteristics similar to that of interfacial water concentration variation as a function of diffusion. The water-stress history along the interface can be modeled as a function dependent principally on water concentration without dependence on position. On this basis, a chemical kinetic model is proposed to explain the joint strength degradation data reported in literature
Keywords :
adhesives; cracks; delamination; finite element analysis; packaging; reaction kinetics; reliability; solvation; adhesive joint; adhesive joints; chemical kinetic model; delamination; finite elements; interfacial crack propagation; interfacial degradation; joint strength degradation data; spatially invariant characteristics; stress distribution; water diffusion; water-stress history; Bonding; Chemicals; Compressive stress; Degradation; History; Kinetic theory; Moisture; Solvents; Tensile stress; Water;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.774734