DocumentCode :
1527976
Title :
Foreword Materials And Process Challenges-contributions From The First International Conference On Electronic Assembly
Author :
Turbin, Laura J.
Author_Institution :
Georgia Institute of Technology, Atlanta
Volume :
20
Issue :
3
fYear :
1997
fDate :
7/1/1997 12:00:00 AM
Firstpage :
173
Lastpage :
173
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Publisher :
ieee
ISSN :
1083-4400
Type :
jour
DOI :
10.1109/TCPMC.1997.649436
Filename :
649436
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1527976
