Title :
Manufacturing concerns when soldering with gold plated component leads or circuit board pads
Author :
Ferguson, Mark E. ; Fieselman, Charles D. ; Elkins, Mark A.
Author_Institution :
IBM Corp., Charlotte, NC, USA
fDate :
7/1/1997 12:00:00 AM
Abstract :
When manufacturing with either gold plated component leads or printed circuit board pads, one must be concerned with the amount of gold in the solder joint. Gold dissolves quickly in tin/lead solders, forming weak, brittle compounds, that when in high enough concentrations, adversely affect the solder joint fatigue life. This paper discusses the effects of gold in tin/lead solder, a qualification test with varying solder paste volumes, calculations for percent Au concentrations, a reliability test and its results, and suggested process controls or manufacturing safeguards
Keywords :
circuit reliability; embrittlement; fatigue; gold; packaging; printed circuit manufacture; printed circuit testing; process control; soldering; Au; Au dissolving; Au plated component leads; QFPs; Sn/Pb solders; SnPb; circuit board pads; embrittlement; fatigue life; manufacturing concerns; manufacturing safeguards; percent Au concentrations; process controls; qualification test; reliability test; solder joint; solder paste volumes; soldering; weak brittle compounds; Fatigue; Gold; Lead; Manufacturing; Printed circuits; Process control; Qualifications; Soldering; Testing; Tin;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
DOI :
10.1109/3476.649439
