• DocumentCode
    1528040
  • Title

    Automated removal and replacement of through-hole components in robotic rework

  • Author

    Geren, Necdet ; Lo, E.K.

  • Author_Institution
    Dept. of Mech. Eng., Cukurova Univ., Adana, Turkey
  • Volume
    20
  • Issue
    3
  • fYear
    1997
  • fDate
    7/1/1997 12:00:00 AM
  • Firstpage
    236
  • Lastpage
    248
  • Abstract
    The need for computer controlled, fully automated rework stations has increased recently due to potential difficulties involved in manual rework of printed circuit board assemblies (PCBAs). An autonomous fully-automated robotic rework cell has been developed for the rework of TH and SM components. This paper concentrates on TH component removal and replacement issues. After a brief introduction to TH rework technology and overall cell structure, it draws attention to the main issues of component removal with regard to gripping and heating. Two multifunctional grippers that are unique in their design are presented as a solution for clinched TH component removals. Since heat is the major issue in the process, dwell times for component removal and replacement are given based on a full scale experimental study. Results of automated TH rework evaluations include the success of leg cutting, spray fluxing, removal and replacement of components
  • Keywords
    assembling; computer integrated manufacturing; industrial manipulators; printed circuit manufacture; reflow soldering; PCB assembly; automated through-hole component removal; automated through-hole component replacement; autonomous fully-automated robotic rework cell; cell structure; clinched TH component removal; computer controlled automated rework stations; dwell times; full scale experimental study; gripping; heating; leg cutting; multifunctional grippers; robotic rework; spray fluxing; Automatic control; Electronics packaging; Heating; Lead; Manufacturing; Printed circuits; Robotic assembly; Robotics and automation; Robots; Samarium;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1083-4400
  • Type

    jour

  • DOI
    10.1109/3476.649447
  • Filename
    649447