Nano-to-millimeter scale integrated systems

Author

Last, Howard R. ; Deeds, Michael ; Garvick, D. ; Kavetsky, R. ; Sandborn, Peter A. ; Magrab, Edward B. ; Gupta, Satyandra K.

Author_Institution

Naval Surface Warfare Center, Indian Head, MD, USA

Volume

22

Issue

2

fYear

1999

fDate

6/1/1999 12:00:00 AM

Firstpage

338

Lastpage

343

Abstract

Over the last several years various industries have been developing nano, micro, and millimeter scale technologies, which have resulted in components ranging from quantum transistors, to widely commercialized integrated circuits, to microelectromechanical sensors. A common emphasis of these fabrication industries has been on the integration of different functions in miniaturized systems; however, the technology currently used to realize these systems is monolithic. A unique class of hybrid technology systems is Integrated nano to millimeter (In2m) systems. An In2m system typically has components spanning multiple sizes, diverse technology domains, and mixtures of electrical, mechanical, thermal, chemical, fluidic, and biological functions

Keywords

micromechanical devices; nanotechnology; In2m; fabrication technology; integrated nano to millimeter system; Assembly; Chip scale packaging; Electronics packaging; Integrated circuit interconnections; Manufacturing processes; Mass production; Multichip modules; Semiconductor device packaging; Semiconductor materials; Weapons;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.774758

Filename

774758