Title :
Finite element simulations of thin-film composite BAW resonators
Author :
Makkonen, Tapani ; Holappa, Antti ; Ella, Juha ; Salomea, M.M.
Author_Institution :
Mater. Phys. Lab., Helsinki Univ. of Technol., Espoo, Finland
Abstract :
A finite element method (FEM) formulation is presented for the numerical solution of the electroelastic equations that govern the linear forced vibrations of piezoelectric media. A harmonic time dependence is assumed. Both of the approaches, that of solving the field problem (harmonic analysis) and that of solving the corresponding eigenvalue problem (modal analysis), are described. A FEM software package has been created from scratch. Important aspects central to the efficient implementation of FEM are explained, such as memory management and solving the generalized piezoelectric eigenvalue problem. Algorithms for reducing the required computer memory through optimization of the matrix profile, as well as Lanczos algorithm for the solution of the eigenvalue problem are linked into the software from external numerical libraries. Our FEM software is applied to detailed numerical modeling of thin-film bulk acoustic wave (BAW) composite resonators. Comparison of results from 2D and full 3D simulations of a resonator are presented. In particular, 3D simulations are used to investigate the effect of the top electrode shape on the resonator electrical response. The validity of the modeling technique is demonstrated by comparing the simulated and measured displacement profiles at several frequencies. The results show that useful information on the performance of the thin-film resonators can be obtained even with relatively coarse meshes and, consequently, moderate computational resources.
Keywords :
acoustic resonators; bulk acoustic wave devices; eigenvalues and eigenfunctions; finite element analysis; harmonic analysis; modal analysis; thin film devices; Lanczos algorithm; eigenvalue problem; electrical response; electroelastic equations; field problem; finite element model; harmonic analysis; linear forced vibration; matrix profile optimization; memory management; modal analysis; numerical simulation; piezoelectric device; software package; thin film bulk acoustic wave composite resonator; top electrode shape; Eigenvalues and eigenfunctions; Equations; Finite element methods; Harmonic analysis; Memory management; Modal analysis; Piezoelectric films; Software algorithms; Software packages; Transistors;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on