Title :
Pulsed THz imaging for non-destructive testing of adhesive bonds
Author :
Schmidhammer, U. ; Jeunesse, P.
Author_Institution :
Lab. de Chim. Phys., Univ. Paris-Sud 11, Orsay, France
Abstract :
We demonstrate imaging with a single-shot THz Time Domain spectrometer for the rapid, but precise location and characterization of defects in an adhesive bond.
Keywords :
adhesive bonding; nondestructive testing; spectrometers; terahertz wave imaging; adhesive bonds; nondestructive testing; pulsed THz imaging; single shot THz time domain spectrometer; Adhesives; Dielectrics; Plastics; Spatial resolution; Testing; Time-domain analysis;
Conference_Titel :
Infrared, Millimeter, and Terahertz waves (IRMMW-THz), 2014 39th International Conference on
Conference_Location :
Tucson, AZ
DOI :
10.1109/IRMMW-THz.2014.6956127
