Title :
The microwave surface impedance of DyBa/sub 2/Cu/sub 3/O/sub 7-x/ very thin films
Author :
Perez, Roxana ; Tybell, T. ; Gupta, A. ; Triscone, J.M. ; Decroux, M. ; Fischer, O.
Author_Institution :
Dept. de Phys. de la Matiere Condensee, Geneva Univ., Switzerland
fDate :
6/1/1997 12:00:00 AM
Abstract :
Measurements of the surface impedance of DyBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// (DyBCO) thin films have been made around 6 GHz by using the parallel plate resonator method with sapphire dielectrics. The films were deposited by RF magnetron sputtering on LaAlO/sub 3/ substrates to thicknesses between 20 and 320 nm. The change of the London penetration depth as a function of temperature is deduced from resonance frequency shifts. A generalized two fluid model is used to fit the data in terms of an effective penetration depth /spl lambda//sub eff/(0) at 0 K, taking into account the effect of grain boundary weak links. This analysis give an interpretation of the changes in /spl lambda//sub eff/(0) as a function of the film thickness and yields values for /spl lambda//sub eff/(0) around 160 nm for films thinner than 120 nm.
Keywords :
barium compounds; dysprosium compounds; electric impedance; electric impedance measurement; grain boundaries; high-temperature superconductors; microwave measurement; penetration depth (superconductivity); sputtered coatings; superconducting thin films; 0 K; 20 to 320 nm; 6 GHz; DyBa/sub 2/Cu/sub 3/O/sub 7-x/ very thin film; DyBa/sub 2/Cu/sub 3/O/sub 7/; LaAlO/sub 3/; LaAlO/sub 3/ substrates; London penetration depth; RF magnetron sputtering; effective penetration depth; generalized two fluid model; grain boundary weak links; microwave surface impedance; parallel plate resonator method; resonance frequency shifts; sapphire dielectrics; temperature dependence; thicknesses; Dielectric measurements; Dielectric substrates; Dielectric thin films; Impedance measurement; Magnetic resonance; Radio frequency; Resonant frequency; Sputtering; Surface impedance; Temperature;
Journal_Title :
Applied Superconductivity, IEEE Transactions on