Optoelectronic multichip module integration for chip level optical interconnects

Author

Prather, D.W. ; Venkataraman, S. ; Lecompte, M. ; Kiamilev, F. ; Mait, J.N. ; Simonis, G.J.

Author_Institution

Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA

Volume

13

Issue

10

fYear

2001

Firstpage

1112

Lastpage

1114

Abstract

We have integrated an 850-nm vertical-cavity surface-emitting laser (VCSEL), its driver, and a diffractive lenslet array onto a single substrate to produce an integrated optoelectronic multichip module for signal fan-out and distribution. The diffractive element performs optical fan-out of the output beam from the VCSEL into an array of focused spots at a plane 1, 416 μm from the surface of the VCSEL. This corresponds to 160 μm from the surface of the diffractive lens. System design, fabrication, integration, and experimental characterization is presented.

Keywords

diffractive optical elements; driver circuits; lenses; multichip modules; optical arrays; optical focusing; optical interconnections; semiconductor laser arrays; surface emitting lasers; 1416 mum; 160 mum; 850-nm vertical-cavity surface-emitting laser; VCSEL; chip level optical interconnects; diffractive element; diffractive lens; diffractive lenslet array; focused spots; integrated optoelectronic multichip module; optical fabrication; optical fan-out; optoelectronic multichip module integration; output beam; signal fan-out; system design; Integrated optics; Integrated optoelectronics; Laser beams; Lenses; Multichip modules; Optical arrays; Optical device fabrication; Optical diffraction; Surface emitting lasers; Vertical cavity surface emitting lasers;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/68.950752

Filename

950752