• DocumentCode
    1529906
  • Title

    Signal Integrity Verification of Multichip Links Using Passive Channel Macromodels

  • Author

    Chinea, Alessandro ; Grivet-Talocia, Stefano ; Hu, Haisheng ; Triverio, Piero ; Kaller, Dierk ; Siviero, Claudio ; Kindscher, Martin

  • Author_Institution
    Dept. of Electron., Politec. di Torino, Torino, Italy
  • Volume
    1
  • Issue
    6
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    920
  • Lastpage
    933
  • Abstract
    This paper presents a general strategy for the electrical performance and signal integrity assessment of electrically long multichip links. A black-box time-domain macromodel is first derived from tabulated frequency responses in scattering form. This model is structured as a combination of ideal delay terms with frequency-dependent rational coefficients. A new identification scheme is presented, which is based on an initial blind delay estimation process followed by a refinement loop based on an iterative delayed vector fitting process. Two alternative passivity enforcement schemes based on local perturbations are then presented. The result is an accurate and guaranteed passive delay-based macromodel, which is synthesized as a SPICE-compatible netlist for channel analysis. The proposed procedure enables safe and reliable circuit-based transient simulations of complex multichip links, including nonlinear drivers and receivers. The performance of the proposed flow is demonstrated on a large number of channel benchmarks.
  • Keywords
    integrated circuit interconnections; SPICE-compatible netlist; black-box time-domain macromodel; channel analysis; complex multichip links; delay terms; electrical performance; frequency response; frequency-dependent rational coefficients; initial blind delay estimation; iterative delayed vector fitting; local perturbations; long multichip links; passive channel macromodels; passive delay-based macromodel; passivity enforcement; refinement loop; reliable circuit-based transient simulation; scattering form; signal integrity assessment; signal integrity verification; Accuracy; Data models; Delay; Frequency domain analysis; Optimization; Scattering; Time domain analysis; Delay extraction; high-speed interconnects; macromodeling; passivity; rational approximations; scattering parameters;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2011.2138136
  • Filename
    5779713