Title :
Forward to the Special Section on “Materials, Processing, and Reliability of 3-D Interconnects”
Author :
Ho, Paul S. ; Smith, Lee ; Tong, Ho-Ming ; Zschech, E.
Author_Institution :
Microelectronics Research Center, The University of Texas at Austin, Austin, USA
fDate :
6/1/2012 12:00:00 AM
Abstract :
The 13 papers in this special section focus on materials, processing, and reliability of 3-D interconnects.
Keywords :
Integrated circuit interconnections; Special issues and sections;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2012.2194830
