• DocumentCode
    1530576
  • Title

    Forward to the Special Section on “Materials, Processing, and Reliability of 3-D Interconnects”

  • Author

    Ho, Paul S. ; Smith, Lee ; Tong, Ho-Ming ; Zschech, E.

  • Author_Institution
    Microelectronics Research Center, The University of Texas at Austin, Austin, USA
  • Volume
    12
  • Issue
    2
  • fYear
    2012
  • fDate
    6/1/2012 12:00:00 AM
  • Firstpage
    188
  • Lastpage
    188
  • Abstract
    The 13 papers in this special section focus on materials, processing, and reliability of 3-D interconnects.
  • Keywords
    Integrated circuit interconnections; Special issues and sections;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2012.2194830
  • Filename
    6210445
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1530576