Title : 
An overview of electrical properties for stress grading optimization
         
        
            Author : 
Rivenc, Jean P. ; Lebey, Thierry
         
        
            Author_Institution : 
Lab. de Genie Electr., Toulouse, France
         
        
        
        
        
            fDate : 
6/1/1999 12:00:00 AM
         
        
        
        
            Abstract : 
The scope of the following paper is to present, both from a theoretical and a practical point of view, some aspects involved in stress grading in the general configuration where insulated HV conductors pass through a grounded screen. The difference between capacitive and resistive materials is discussed; particular attention is devoted to the rules governing the potential and the field distribution in both cases. The case of a capacitive varnish with nonlinear permittivity is discussed and a comparison with materials of constant permittivity is made. The experimental behavior of nonlinear semiconducting materials used in practice are examined and a discussion is given on the possible use of resistive materials of constant conductivity. Finally, practical considerations are listed as basic rules for optimizing the grading effect
         
        
            Keywords : 
conductors (electric); electric fields; electric potential; high-voltage engineering; insulating coatings; insulation; permittivity; semiconductors; varnish; capacitive materials; capacitive varnish; constant conductivity; constant permittivity; electrical properties; field distribution; grading effect optimisation; grounded screen; insulated HV conductors; nonlinear permittivity; nonlinear semiconducting materials; potential; resistive materials; stress grading optimization; Conducting materials; Dielectrics and electrical insulation; Machine windings; Permittivity; Semiconductivity; Semiconductor materials; Stator cores; Stator windings; Stress; Surface discharges;
         
        
        
            Journal_Title : 
Dielectrics and Electrical Insulation, IEEE Transactions on