Title :
Fast RF-CV Characterization Through High-Speed 1-port S-Parameter Measurements
Author :
Herfst, Rodolf W. ; Steeneken, Peter G. ; Tiggelman, Mark P J ; Stulemeijer, Jiri ; Schmitz, Jurriaan
Author_Institution :
Surface Acoust. Wave Components Div., EPCOS Netherlands BV, Nijmegen, Netherlands
Abstract :
We present a fast radio frequency-capacitance-voltage (RF-CV) method to measure the CV relation of an electronic device. The approach is more accurate, much faster, and more cost effective compared to the existing off-the-shelf solutions. Capacitances are determined using a single-frequency 1-port S-parameter setup constructed from discrete components. We introduce a new way to correct for nonlinearities of the used components, which greatly increases the accuracy with which the phase and magnitude of the reflected signal is measured. The measurement technique is validated on an RF microelectromechanical systems capacitive switch and a barium-strontium-titanate tunable capacitor. Complete CV curves are measured in less than a millisecond, with a measurement accuracy well below 1%.
Keywords :
S-parameters; barium compounds; capacitance measurement; capacitors; microswitches; radiofrequency measurement; strontium compounds; voltage measurement; BST; CV curves; CV relation measurement; RF microelectromechanical systems capacitive switch; barium-strontium-titanate tunable capacitor; discrete components; electronic device; fast RF-CV characterization; fast radiofrequency-capacitance-voltage method; high-speed 1-port S-parameter measurements; reflected signal; single-frequency 1-port S-parameter setup; Calibration; Capacitance; Capacitance measurement; Capacitance-voltage characteristics; Phase measurement; Radio frequency; Semiconductor device measurement; Barium-strontium-titanate (BST); MOS capacitor; capacitance; capacitance measurement; capacitive switches; metal–oxide–semiconductor field-effect transistor (MOSFET); radio frequency (RF); radio frequency microelectromechanical (RF MEMS); varactor;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2012.2202752