DocumentCode :
1532537
Title :
Test Structures for Characterizing the Integration of EWOD and SAW Technologies for Microfluidics
Author :
Li, Yifan ; Fu, Richard Yongqing ; Winters, D. ; Flynn, Brian W. ; Parkes, Bill ; Brodie, Douglas Stuart ; Liu, Yufei ; Terry, Jonathan ; Haworth, Les I. ; Bunting, A.S. ; Stevenson, J.T.M. ; Smith, Stewart ; Mackay, C. Logan ; Langridge-Smith, Pat R R ;
Author_Institution :
Univ. of Edinburgh, Edinburgh, UK
Volume :
25
Issue :
3
fYear :
2012
Firstpage :
323
Lastpage :
330
Abstract :
This paper presents details of the design and fabrication of test structures specifically designed for the characterization of two distinct digital microfluidic technologies: electro-wetting on dielectric (EWOD) and surface acoustic wave (SAW). A test chip has been fabricated that includes structures with a wide range of dimensions and provides the capability to characterize enhanced droplet manipulation, as well as other integrated functions. The EWOD and SAW devices have been separately characterized first of all to determine whether integration of the technologies affects their individual performance, including device lifetime evaluation. Microfluidic functions have then been demonstrated, including combined EWOD/SAW functions. In particular, this paper details the use of EWOD to anchor droplets, while SAW excitation is applied to perform mixing. The relationship between test structure designs and the droplets anchoring performance has been studied.
Keywords :
integrated circuit design; integrated circuit testing; microfluidics; surface acoustic waves; EWOD; SAW; device lifetime evaluation; digital microfluidic technologies; droplets anchoring performance; electro-wetting on dielectric; microfluidic functions; microfluidics; surface acoustic wave; test chip; test structures; Dielectrics; Electrodes; Fabrication; Performance evaluation; Substrates; Surface acoustic wave devices; Surface acoustic waves; Contact angle; electro-wetting on dielectric (EWOD); integration; surface acoustic wave (SAW); test structure;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2012.2202770
Filename :
6212373
Link To Document :
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