• DocumentCode
    1532598
  • Title

    A BiCMOS active substrate probe-card technology for digital testing

  • Author

    Zargari, Masoud ; Leung, Justin ; Wong, S. Simon ; Wooley, Bruce A.

  • Author_Institution
    Center for Integrated Syst., Stanford Univ., CA, USA
  • Volume
    34
  • Issue
    8
  • fYear
    1999
  • fDate
    8/1/1999 12:00:00 AM
  • Firstpage
    1118
  • Lastpage
    1135
  • Abstract
    An active substrate silicon probe card has been implemented by forming a polyimide membrane on a silicon substrate. The probe card combines tungsten probe tips and aluminum interconnects in the polyimide membrane with active test circuitry integrated in the substrate. A monolithic prototype of the probe card designed to enhance the capabilities of conventional digital test systems has been fabricated in a 2-μm BiCMOS technology. The benefits of the proposed probe-card technology could be further exploited by integrating the timing measurement unit of a digital tester into the probe-card substrate. An integrated tester architecture based on time digitization is described. A prototype of a tester combining a time digitizer and two test channels has been integrated in a 0.6 μm BiCMOS technology. The time digitizer in the experimental circuit employs a two-stage ring oscillator that is phase-locked to an external reference and makes use of phase interpolation to achieve a timing resolution of 90 ps
  • Keywords
    BiCMOS integrated circuits; automatic test equipment; integrated circuit testing; phase locked loops; probes; silicon; substrates; timing circuits; tungsten; 0.6 micron; 2 micron; 90 ps; ATE; Al; Al interconnects; BiCMOS technology; Si; Si substrate; W; W probe tips; active substrate probe-card technology; active test circuitry; digital testing; integrated tester architecture; monolithic prototype; phase interpolation; polyimide membrane; silicon probe card; time digitization; timing measurement unit; two-stage ring oscillator; BiCMOS integrated circuits; Biomembranes; Circuit testing; Integrated circuit technology; Polyimides; Probes; Prototypes; Silicon; Timing; Tungsten;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/4.777110
  • Filename
    777110