• DocumentCode
    1532970
  • Title

    High-frequency four noise parameters of silicon-on-insulator-based technology MOSFET for the design of low-noise RF integrated circuits

  • Author

    Dambrine, Gilles ; Raskin, Jean-Pierre ; Danneville, François ; Vanhoenackel Janvier, D. ; Colinge, Jean-Pierre ; Cappy, Alain

  • Author_Institution
    Dept. Hyperfrequences et Semicond., IEMN, Villeneuve d´´Ascq, France
  • Volume
    46
  • Issue
    8
  • fYear
    1999
  • fDate
    8/1/1999 12:00:00 AM
  • Firstpage
    1733
  • Lastpage
    1741
  • Abstract
    An exhaustive experimental study of the high-frequency noise properties of MOSFET in silicon-on-insulator (SOI) technology is presented. Various gate geometries are fabricated to study the influence of effective channel length, gate finger width, and gate sheet resistivity on the four noise parameters. The high level of MOSFET sensitivity to the minimum noise matching condition is demonstrated. From experimental results, optimal ways to realize ultra low noise amplifiers are discussed. The capability of the fully depleted standard SOI CMOS process for realizing low-noise amplifiers for multigigahertz portable communication systems is shown
  • Keywords
    MOSFET; digital radio; microwave field effect transistors; personal communication networks; semiconductor device noise; silicon-on-insulator; MOSFET; effective channel length; fully depleted standard process; gate finger width; gate geometries; gate sheet resistivity; high-frequency noise properties; low-noise RF integrated circuits; minimum noise matching condition; multigigahertz portable communication systems; silicon-on-insulator-based technology; ultra low noise amplifiers; 1f noise; CMOS technology; Circuit noise; Integrated circuit noise; Integrated circuit technology; MOSFET circuits; Microwave devices; Radio frequency; Semiconductor device noise; Silicon on insulator technology;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.777164
  • Filename
    777164